Technology Platform Development
1. IC and module assembly technology development.
2. Participation/management of investment projects related to IC and module attachment.
Process Platform Development
3. Process development of IC and module attachment processes to improve their quality, cost effectiveness, throughput and performance. Process development includes developing and defining used materials, process parameters, quality assurance as well as definition of the output of the process.
4. Identify opportunity for equipment and process improvement to drive continuous quality improvement and cost. Work with the Operations department and other Engineers to explore feasibility of implementation.
Materials Development
5. Participation and expert responsibility in sourcing, evaluating and qualifying new raw materials, tools and consumables for IC and module attachment processes.
Design & Qualification Processes
6. Defining, evaluating and qualifying of new product designs.
7. Planning and execution of qualification runs of new products.
Job Requirements:
- Candidate must possess at least a Bachelor's Degree in Electronics/ Electrical/ Mechanical/ Materials/ Production Engineering.
- At least 1 year of working experience in a related field (i.e. semiconductor assembly or fabrication).
- Possess professional knowledge such as quality techniques (i.e .Six Sigma tools), deep process specific knowhow (preferably semiconductor fabrication, testing and assembly processes).
- Required language(s): English and preferably also Bahasa Melayu.
- Self starter, independent and able to multitask.
- Combination of hands-on approach and theoretical capabilities.
- Having strong quantitative, analytical & problem solving skills, effective prioritization and time management skills.
- Good data analysis skills (excel, minitab) and reporting skills.
- Ability to create and manage a project plan (MS Project).
- Good communication and interpersonal skills.
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